PCB's & Substrates

Printed circuit boards, flexible substrates, laminates, and polyimide films form the foundation of electronic assemblies. Variations in glass transition temperature, coefficient of thermal expansion, modulus, thermal stability, and moisture-driven dimensional change can contribute to warpage, delamination, cracked vias, and reliability failures. TA Instruments helps characterize these materials using TMA, DMA, DSC, TGA, and mechanical testing to support material selection, process control, and long-term reliability.