Solders

Solder alloys, solder pastes, flux systems, and conductive adhesives must meet tight requirements for melting behavior, printability, slump resistance, residue formation, and thermal stability. TA Instruments helps characterize reflow behavior, flux volatilization, oxidation, residue content, viscosity, yield stress, and thixotropic recovery to support cleaner processing, consistent deposition, and reliable electrical and mechanical connection.