Structural Adhesives

Electronic adhesives, underfills, encapsulants, and conformal coatings must flow predictably, cure completely, and maintain mechanical integrity through thermal cycling, humidity exposure, and mechanical stress. Incomplete cure, poor dispensing behavior, residual exotherm, CTE mismatch, or modulus changes can lead to voids, delamination, cracking, and package failure. TA Instruments provides rheology, DSC, DMA, TMA, and TGA solutions to help optimize formulation, dispensing, cure schedules, and long-term reliability.